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Master's Dissertation
DOI
https://doi.org/10.11606/D.3.2011.tde-09122011-105117
Document
Author
Full name
Cristiano Fernandes Lagatta
E-mail
Institute/School/College
Knowledge Area
Date of Defense
Published
São Paulo, 2011
Supervisor
Committee
Souza, Roberto Martins de (President)
Adamowski, Júlio Cezar
Recco, Abel André Cândido
Title in Portuguese
Medição de tensões residuais em filmes finos durante o processo de deposição.
Keywords in Portuguese
Filmes finos
Medição in-situ
Nitreto de titânio
Tensões residuais
Triodo magnetron sputtering
Abstract in Portuguese
Neste trabalho foram realizadas algumas deposições de filmes de Nitreto de Titânio sobre substrato de aço inoxidável. Foi utilizado o processo conhecido como triodo magnetron sputtering. Os parâmetros de deposição foram mantidos entre as deposições, exceto pela voltagem de bias no substrato, que foi variada de uma deposição para outra. Medições in-situ das tensões residuais no filme depositado foram realizadas. As medições foram feitas através do método da curvatura do substrato, utilizando-se um sensor capacitivo posicionado dentro da câmara de deposição. Embora o dispositivo não tenha sido capaz de quantificar os valores de tensão, foi possível identificar a natureza das mesmas, indicando se elas são de caráter trativo ou compressivo. Comprovou-se a possibilidade do uso de sistemas capacitivos para medições em sputtering. Observou-se que os filmes depositados apresentaram tensões de caráter trativo durante as deposições.
Title in English
Thin films residual stress measurement during deposition process.
Keywords in English
In-situ measurement
Residual stress
Thin films
Titanium nitride
Triode magnetron sputtering
Abstract in English
In this work, a series of depositions of titanium nitride thin films was conducted in a triode unbalanced magnetron sputtering chamber. Similar parameters were selected during each deposition, except for the substrate bias voltage, which was different for every deposition. An in-situ measurement of film residual stresses was carried out as the depositions proceeded. This measurement was based on substrate curvature, which was assessed by a home-built capacitive sensor positioned inside the sputtering chamber. Although the measurement device was not able to quantify the stress values, it was possible to identify if they were tensile or compressive. It was proved the possibility of using capacitive measurement devices in sputtering processes. It was possible to observe that the films underwent tensile stresses during the deposition.
 
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Publishing Date
2011-12-12
 
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